SOFT RECOVERY DIODE DIE

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Part Number	Die size (mils)	Package	Product Family	Reference packed part	Trr (nsec) typ at 1A	Trr (nsec) max at If	Vf max (V) at If, 25°C	Tjmax (°C)	Rated current (A)	Voltage (V)
VS060LM06CS02CB	60X60	DIE ON WAFER	Bondable Moat Fast	N/A	55	200	1.3	150	2	600
VS135LM06CS02CB	100x135	DIE ON WAFER	Bondable Moat Fast	8EWF06SPBF	55	200	1.2	150	8	600
VS180LG10HS05	180X180	CHIP PACK	Solderable Fast Mesa	16FL serie		500	1.4	150	16	1000/1200
VS180LM06CS02CB	180X180	DIE ON WAFER	Bondable Moat Fast	20ETF series		200	1.3	150	20	600
VS180LM12CS05CB	180X180	DIE ON WAFER	Bondable Moat Fast	20ETF series		500	1.35	150	20	1000/1200
VS207LM06CS02CB	207X157	DIE ON WAFER	Bondable Moat Fast	20ETF series		200	1.3	150	20	600
VS230LM06CS02CB	230X230	DIE ON WAFER	Bondable Moat Fast	40EPF series	60	200	1.08 at 20A	150	30	600
VS340LM06CS02CB	350X230	DIE ON WAFER	Bondable Moat Fast	60EPF series		200	1.3	150	60	600
VS340LM12S05CB	350X230	DIE ON WAFER	Bondable Moat Fast	60EPF series		500	1.3	150	60	1200
VS390LM06CS02CB	390x270	DIE ON WAFER	Bondable Moat Fast	80EPF series		200	1.25	150	80	600
VS390LM12CS05CB	390x270	DIE ON WAFER	Bondable Moat Fast	80EPF series		500	1.3	150	80	1000/1200
Part Number	Die size (mils)	Package	Product Family	Reference packed part	Trr (nsec) typ at 1A	Trr (nsec) max at If	Vf max (V) at If, 25°C	Tjmax (°C)	Rated current (A)	Voltage (V)