Die wafer - Photo Detectors

Sales, Technical Questions...

Links
Optoelectronics Portfolio
Infrared emitters LEDs Reflective sensors Interrupters Infrared transceivers Optocouplers IR receivers
Product Guides

Part Number	Device Type	Package Type	Package Form	Package Dimensions L x W x H (mm)	Peak Wavelength λ_p (nm)	Spectral Bandwidth (nm)	Output	Angle of Half Sensitivity φ (± deg)	Photo Sensitive Area (mm²)
T1070P	Photo- transistor	chip	Chip	0.72 x 0.72 x 0.22	570	440 to 800	50 µA	60
T1090P	Photo- transistor	chip	Chip	0.53 x 0.53 x 0.185	825	440 to 1070	0.43 to 0.77 mA	60
T1110P6	PIN Photodiode	chip	Chip	2.97 x 2.97 x 0.28	940	430 to 1100	55 µA	60	7.5
T1116P	PIN Photodiode	chip	Chip	2.97 x 2.97 x 0.28	940	350 to 1100	43 µA	60	7.7
T1120P	PIN Photodiode	chip	Chip	2.37 x 2.37 x 0.28	940	430 to 1100	35 µA	60	4.4
T1610P	PIN Photodiode	chip	Chip	2.97 x 2.97 x 0.28	560	390 to 800	2.9 µA	60	100
T1670P	PIN Photodiode	chip	Chip	0.72 x 0.72 x 0.28	560	390 to 800	138 nA	60	100
T330P	PIN Photodiode	chip	Chip	0.67 x 0.67 x 0.28	900	430 to 1100	2.3 µA	60	100