Die wafer - Infrared emitting diodes
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Product Guide
|
Part number
|
Package
Type
|
Package
Form
|
Package Dimensions
(L x W x H)
(mm) |
Peak Wavelength
(nm) |
Radiant Intensity
(mW/sr) |
Angle of Half Intensity
(±°) |
Rise Time
(ns) |
|---|---|---|---|---|---|---|---|
| Chip | 0.37 x 0.37 x 0.265 | 950 | 1.2 | 0 | 800 | ||
| chip | Chip | 0.37 x 0.37 x 0.17 | 850 | 3.3 | 80 | 25 | |
| chip | Chip | 0.37 x 0.37 x 0.16 | 865 | 4.2 | 80 | 13 | |
| chip | Chip | 0.47 x 0.47 x 0.16 | 870 | 5.8 | 80 | 15 | |
| chip | Chip | 0.37 x 0.37 x 0.17 | 885 | 3.7 | 80 | 25 | |
| chip | Chip | 0.37 x 0.37 x 0.19 | 940 | 4.3 | 80 | 15 | |
| chip | Chip | 0.508 x 0.508 x 0.17 | 850 | 75 | 55 | 15 | |
| chip | Chip | 1.066 x 1.066 x 0.17 | 850 | 350 | 55 | 15 |






